Computes the thickness of an Intermetallic Compound (IMC)
given the average operating temperature and time period.
This calculator is currently limited to Ni-modified
SnCu soldered onto a copper-based plating (OSP, ImAg, ImSn).
It is designed to provide guidance on when the response of
this solder joint type changes from ductile (beta > 2) to
brittle (beta ~1) when exposed to mechanical shock / drop