Intermetallic Growth Due to Thermal Aging Inputs

Computes the thickness of an Intermetallic Compound (IMC) given the average operating temperature and time period.

This calculator is currently limited to Ni-modified SnCu soldered onto a copper-based plating (OSP, ImAg, ImSn). It is designed to provide guidance on when the response of this solder joint type changes from ductile (beta > 2) to brittle (beta ~1) when exposed to mechanical shock / drop events.


Average Temperature:
Time Period:

Intermetallic Growth Due to Thermal Aging Results
IMC Thickness:

Note: 3.2 to 3.4 µm is the critical Intermetallic Compound (IMC) thickness beyond which brittle fracture occurs.