Computes the Mean Fatigue Life for Printed Circuit Board (PCB) materials using the
IPC-TR-579 Failure Model.
The calculations are based on the type and thickness of the material,
the PTH size and the expected thermal environment.
NOTE: This calculation is not solvable for PCB materials with out-of-plane expansion of less than 30 ppm. This calculation is also not valid for Interconnect Stress Testing (IST). Cycles to failure for IST can be as much as 3X greater than standard temperature cycling.