Solder joints provide electrical, thermal, and mechanical connections between
electronic components and a printed board. During changes in temperature, the
component and printed board will expand or contract by dissimilar amounts due
to differences in the coefficient of thermal expansion (CTE). This difference
in expansion or contraction will place the second-level solder joint under a
shear load. Repeated exposure to temperature changes, such as power on/off or
diurnal cycles, can introduce damage into the bulk solder. With each additional
temperature cycle, this damage accumulates, leading to creack propagation and
eventual failure of the solder joint.
We're always interested to hear from users about both good and not-so-good
experiences using Sherlock. We take all feedback seriously and constantly strive
to make Sherlock easier to use, more accurate and more reliable. So, if you have
any comments to share with us, please feel free to send them using this form.