Solder Joint Fatigue Inputs - Ceramic Ball Grid Array

Solder joints provide electrical, thermal, and mechanical connections between electronic components and a printed board. During changes in temperature, the component and printed board will expand or contract by dissimilar amounts due to differences in the coefficient of thermal expansion (CTE). This difference in expansion or contraction will place the second-level solder joint under a shear load. Repeated exposure to temperature changes, such as power on/off or diurnal cycles, can introduce damage into the bulk solder. With each additional temperature cycle, this damage accumulates, leading to creack propagation and eventual failure of the solder joint.

Solder Material:
Solder Thickness: Between .010 and 0.254 mm
Use default solder parameters
Bond Pad Length: Bond Pad Modulus:
Bond Pad Width: Bond Pad Pitch:
Bond Pad Thickness:

Package Length: Package Modulus:
Package Width: Package CTE:
Package Thickness: Package Poisson Ratio:
Laminate Thickness: Package Density:

Overmold Thickness: Overmold Poisson Ratio:
Overmold Modulus: Overmold CTE:

Lead Count: Lead Hole Diameter:
Lead Height: Lead Foot Length:
Lead Width: Lead Modulus:
Lead Thickness: Lead CTE:

Ball Pattern: Ball Package Diameter:
Ball Count: Ball Pad Diameter:
Ball Diameter: Ball Pitch:
Ball Height: Ball Chan Width:

PCB Thickness:  
PCB Tensile Modulus: PCB CTE XY:

Die Length: Die Modulus:
Die Width: Die CTE:
Die Thickness: Die Poisson Ratio:

Flag Length: Flag Modulus:
Flag Width: Flag CTE:
Flag Thickness:

Minimum Temperature: Dwell Time:
Maximum Temperature: Dwell Time:
Part Min Temperature:
Part Max Temperature:

Solder Joint Fatigue Results
Cycles To Failure:
Strain Energy: