Capacitor Flex Cracking
Capacitor Flex Cracking

Multilayer Ceramic Capacitors (MLCC), also known as Chip Capacitors, are among the most common, and most fragile, of components used in Circuit Card Assemblies (CCAs). Flex cracking, caused by excessive bending of the printed circuit board under the MLCC, is one of the most common reasons for field failures in electronic devices and is almost exclusively driven by design decisions. This calculator allows the user to predict the probability of flex cracking and see how adjusting certain design parameters will allow the user to avoid this failure mechanism.


Solder Joint Fatigue
Solder Joint Fatigue

Solder joints provide electrical, thermal, and mechanical connections between electronic components and a printed board. During changes in temperature, the component and printed board will expand or contract by dissimilar amounts due to differences in the coefficient of thermal expansion (CTE). This difference in expansion or contraction will place the second-level solder joint under a shear load. Repeated exposure to temperature changes, such as power on/off or diurnal cycles, can introduce damage into the bulk solder. With each additional temperature cycle, this damage accumulates, leading to creack propagation and eventual failure of the solder joint.


Plated Through Hole (PTH) Fatigue
Plated Through Hole (PTH) Fatigue

Computes the Mean Fatigue Life for Printed Circuit Board (PCB) materials using the IPC-TR-579 Failure Model. The calculations are based on the type and thickness of the material, the PTH size and the expected thermal environment.


Component Vibration Fatigue
Component Vibration Fatigue

Computes the Cycles to Failure for various component types using the Steinberg Fatigue Model. The calculations are based on the expected vibration environment, as well as the given component and Printed Circuit Board (PCB) characteristics.


Intermetallic Growth Due to Thermal Aging
Intermetallic Growth Due to Thermal Aging

Computes the thickness of an Intermetallic Compound (IMC) given the average operating temperature and time period.

This calculator is currently limited to Ni-modified SnCu soldered onto a copper-based plating (OSP, ImAg, ImSn). It is designed to provide guidance on when the response of this solder joint type changes from ductile (beta > 2) to brittle (beta ~1) when exposed to mechanical shock / drop events.


Thermal Cycling to Service Life Correlation
Thermal Cycling to Service Life Correlation

Correlates thermal test results with expected field results or vice versa. If you enter non-zero values for any three of the four fields, then the remaining value will be calculated.

This calculator is currently limited to SnPb solder.


Unit Conversion
Unit Conversion

Converts values from one unit of measurement to another.